nVent to Showcase AI-Enabling High-Performance Liquid Cooling and Power Distribution Solutions at SC24
- nVent highlighting liquid cooling solutions for NVIDIA GB200 platform
- Liquid-to-air cooling solution to be demonstrated by Lenovo and nVent
- nVent booth featuring smart 100 amp high density rack power distribution units
LONDON–(BUSINESS WIRE)–nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, today announced that it will unveil its latest liquid cooling innovations for high-performance computing and AI at SC24.
nVent is a leader and innovator in liquid cooling with a strong track record of solving the toughest cooling challenges for global cloud service providers and collaborating to support the future of AI computing. nVent provides standard and custom solutions for the next generation of computing supported by its global scale and capacity. It is well-positioned to deliver resilient and sustainable liquid cooling and power solutions to support AI and high-performance computing around the globe.
nVent will display its latest innovations at booth #1738, spotlighting liquid cooling for the NVIDIA GB200 platform. nVent’s complete solution includes rack and row liquid-to-liquid coolant distribution units, row-based liquid-to-air (LTA) heat rejection units, coolant distribution manifolds, rear door air-to-liquid (ATL) heat exchangers and Open Compute Project (OCP) ORV3 racks. nVent will also be displaying its AI-ready high density power management solutions, including its 100 amp smart PDU.
“Our innovative and extensive portfolio is tailored to address the specific requirements of hyperscale and multi-tenant data centers. We rely on our deep technical expertise and strong global supply chain to deliver for our customers,” said Eric Osborn, VP and general manager, data center solutions at nVent.
“nVent is well-positioned to innovate and scale our liquid cooling solutions alongside rapid design cycles from chip manufacturers, supporting the next generation of high-density computing in data centers,” said Marc Caiola, VP, data center solutions – cooling and networking at nVent.
nVent’s row-based LTA heat rejection unit is a scalable liquid cooling solution that allows data centers to support AI and high-performance workloads without relying on facility-wide liquid cooling infrastructure. nVent’s LTA solution offers a modular design allowing for easy expansion as cooling demands grow and toolless hot swappable features that provide easy installation and serviceability. nVent will be showcasing its LTA solution in its booth as well as in Lenovo’s booth, #2201.
Learn more about nVent’s liquid cooling and power distribution portfolio here.
About nVent
nVent is a leading global provider of electrical connection and protection solutions. We believe our inventive electrical solutions enable safer systems and ensure a more secure world. We design, manufacture, market, install and service high performance products and solutions that connect and protect some of the world’s most sensitive equipment, buildings and critical processes. We offer a comprehensive range of enclosures, electrical connections and fastening and thermal management solutions across industry-leading brands that are recognized globally for quality, reliability and innovation. Our principal office is in London and our management office is in the United States in Minneapolis. Our robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, ILSCO, RAYCHEM and SCHROFF. Learn more at www.nvent.com.
nVent, CADDY, ERICO, HOFFMAN, ILSCO, RAYCHEM and SCHROFF are trademarks owned or licensed by nVent Services GmbH or its affiliates.
Contacts
Stacey Wempen
Director, External Communications
nVent
612-819-6188
Stacey.Wempen@nVent.com
